Computer Simulation of ElectroMigration in Microelectronics Interconnect
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منابع مشابه
Electromigration in Interconnect Structures of Microelectronics Circuits
We present a comprehensive physical model for the whole life cycles of electromigration induced voids. Special emphasis is put on explaining the void morphology and its impact on interconnect resistance. Investigations for common twoand three-dimensional interconnect structures are presented. Implications of the theoretical analysis and the simulation results for modern interconnect design are ...
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Electromigration is one of the most important reliability issues in semiconductor technology. Its complex character demands comprehensive physical modeling as basis for analysis. Simulation of electromigration induced interconnect failure focuses on the life-cycle of intrinsic voids, which consists of two distinct phases: void nucleation and void evolution. We present models for both phases as ...
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Electromigration driven void dynamics plays an important role in the reliability of copper interconnects; a proper understanding of which is made more difficult due to local variations in line microstructure. In simulations, the parameter which best incorporates these variations is the effective atomic diffusivity D eff which is sensitive to grain size and orientation, interface layer thickness...
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Electromigration failure is a major reliability concern for integrated circuits. The continuous shrinking of metal line dimensions together with the interconnect structure arranged in many levels of wiring with thousands of interlevel connections, such as vias, make the metallization structure more susceptible to failure. Mathematical modeling of electromigration has become an important tool fo...
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Electromigration versus line width in the 0.12–10 lm range and the configuration of the via/line contact in dual damascene Cu has been investigated. There are two scenarios for width scaling impact on electromigration. One is the width < 1 lm region, in which the MTF shows a weak width dependence, except for the via-limited condition. The other is the width > 1 lm region, in which the MTF shows...
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تاریخ انتشار 2015